| 摘要 |
PROBLEM TO BE SOLVED: To provide a sandwiching type semiconductor socket which can prevent the decline of the measurement accuracy of a semiconductor measuring instrument which has a dual-transmission line constitution and is used for testing a semiconductor device using a sandwiching type connecting device due to the internal inductance of the connecting device which prevents a waveform from being inputted to the semiconductor device at desired timing when the instrument is used for testing a semiconductor device having a data transfer rate of >=800 Mbits/s/pin and a decline in yield when the instrument is mass-produced. SOLUTION: In this sandwiching type semiconductor socket provided with a plurality of contact sections, each of which is composed of a contact piece for input which is always in contact with the common pin or solder ball of a semiconductor to be measured and a contact piece for output, the solder ball pin of the semiconductor is set to the electrical midpoint of the DTL by making the inductance values LS of all contact pieces equal to each other.
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