| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain an aqueous dispersion for polishing chemical machinery comprising an organic compound having at least one kind of actions of (1) suppressing the deterioration of polishing pads, (2) suppressing pitting of surfaces to be polished from occurring and (3) flattening a difference in levels of the surfaces to be polished. SOLUTION: This aqueous dispersion for polishing the chemical machinery comprises abrasive grains comprising inorganic abrasive grains such as silica or alumina or organic inorganic composite grains, the organic compound having the above specific actions and water. Heterocyclic compounds, or the like, having a heterocyclic five-membered ring without a benzene ring forming the skeleton and having functional groups such as bipyridyl, biphenol, vinylpyridine, salicylaldoxime and 7-hydroxy-5-methyl-1,3,4-triazaindolizine or 2-amino-1,3,4- thiadiazole are cited as the organic compound. Only one kind of the organic compound may be used or two or more kinds may be used in combination.</p> |
