| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid state resin composition for sealing a semiconductor, excellent in low stress property and low arching property. SOLUTION: This liquid state resin composition comprises (A) an epoxy resin having >=2 glycidyl groups and >=1 glycidylaniline groups in 1 molecule, and being a liquid state at a normal temperature, (B) an epoxy resin being a liquid state at the normal temperature, (C) a silicone-modified liquid state epoxy resin having a siloxane structure, (D) a liquid state polyphenol, (E) a curing accelerator and (F) an inorganic filler. Also, the semiconductor device by using the above liquid state resin composition is provided.
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