发明名称 Film forming method for a semiconductor device
摘要 <p>There is provided a film forming method of forming a silicon-containing insulating film 204 on a deposited substrate 103 by reacting a compound having siloxane bonds and Si-R bonds (R is alkyl group) with a plasmanized reaction gas containing an oxidizing gas and H2. &lt;IMAGE&gt;</p>
申请公布号 EP1143499(A2) 申请公布日期 2001.10.10
申请号 EP20010107804 申请日期 2001.04.05
申请人 CANON SALES CO., INC.;SEMICONDUCTOR PROCESS LABORATORY CO., LTD. 发明人 IKAKURA, HIROSHI;SUZUKI, TOMOMI;MAEDA, KAZUO;SHIOYA, YOSHIMI;OHIRA, KOUICHI
分类号 C23C16/40;C23C16/505;H01L21/31;H01L21/312;H01L21/316;(IPC1-7):H01L21/312 主分类号 C23C16/40
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