发明名称 HEAT AND SOUND INSULATION BOARD AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a heat and sound insulation plate by using strong thin plates and hard urethane plates. SOLUTION: This plate is provided by alternately superposedly bonding a plurality of strong rectangular thin plates and hard urethane plates having the same shape as the thin plates and a specified thickness, into one body of board.
申请公布号 JP2001279842(A) 申请公布日期 2001.10.10
申请号 JP20000099559 申请日期 2000.03.31
申请人 TANAKA YUTAKA 发明人 TANAKA YUTAKA
分类号 E04B1/90;B32B5/18;E04B1/86;E04C2/26;(IPC1-7):E04B1/90 主分类号 E04B1/90
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