发明名称 EPOXY RESIN COMPOSITION FOR LAMINATING PLATE AND LAMINATING PLATE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition for lamination plate which hardens promptly, gives a high quality formed article and has good formability, when thermoformed and capable of keeping stable for long time in near the room temperature. SOLUTION: This composition comprises as essential components an epoxy resin (A), an epoxy resin hardening agent (B) selected from a polyamine, a polyphenol or an acid anhydride, and at least one molecular compound (C) having the hardening promotion effect which is selected from the group of compounds which are a molecular associator of a tetra-substituted phosphonium and a dihydric phenol compound.
申请公布号 JP2001278953(A) 申请公布日期 2001.10.10
申请号 JP20000089679 申请日期 2000.03.28
申请人 SUMITOMO BAKELITE CO LTD 发明人 GO YOSHIYUKI
分类号 C08G59/50;C08G59/48;C08G59/62;C08G59/68;H05K1/03;(IPC1-7):C08G59/50 主分类号 C08G59/50
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