| 摘要 |
PROBLEM TO BE SOLVED: To provide a hardening agent for epoxy resin to obtain the semiconductor sealing composition having a good forming hardenability as well as a low viscosity, a low hygroscopic property and a high glass transition temperature and to provide a semiconductor sealing composition using this agent. SOLUTION: A composition comprising (A) a monofunctional condensed polycyclic oxazine compound which is formed by condensing an oxazine ring such as a benzoxazine or the like with an aromatic hydrocarbon ring and (B) a polyphenol such as a phenol aralkyl resin or the like shown by formula (2): Ph(OH)-[HC(Ph)-(Ph)OH)]m[CH2-(Ph)-CH2-(Ph)OH]n]-H or formula (3): Ph(OH)-[CH2-(Ph)-(Ph)-CH2-(Ph)OH)]p-CH2-(Ph)-(Ph)-CH2-(Ph)OH) is used as a hardening agent for epoxy resin, and a composition comprising this composition, (C) an epoxy resin, (D) an inorganic filler and (E) a hardening agent in used as a resin for semiconductor sealing. (In the formulae, Ph is a benzene ring such as phenyl, phenylene or the like m>=0, n>=0, m+n>=1, P>=0).
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