发明名称 POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin composition developable with an alkaline aqueous solution, having high sensitivity and capable of easily forming a patterned thin film excellent in various characteristics such as flatness, high resolution, developability, heat and chemical resistances, adhesion to a substrate, transparency and insulating property and to provide a photosensitive resin composition capable of easily forming a patterned thin film excellent in low dielectric property as well as in the above various characteristics and a pattern forming method using the composition. SOLUTION: Each of the photosensitive resin compositions is a positive type photosensitive resin composition containing at least an alkali-soluble acrylic resin having an unsaturated ethylene group, a 1,2-naphthoquinonediazido- containing compound and a crosslinker. In the pattern forming method in which the positive type photosensitive resin composition is successively subjected to application, 1st exposure, development, 2nd exposure and heating, the quantity of light in the 2nd exposure is 2-15 times that in the 1st exposure.
申请公布号 JP2001281853(A) 申请公布日期 2001.10.10
申请号 JP20000100921 申请日期 2000.04.03
申请人 FUJIFILM ARCH CO LTD 发明人 TAKAGI YOSHIHIRO
分类号 G03F7/022;C08F2/44;C08F2/50;C08F299/00;C08K5/1515;C08K5/28;C08K5/3477;C08L33/04;G03F7/004;G03F7/023;G03F7/028;G03F7/038;G03F7/20;G03F7/40;H01L21/027 主分类号 G03F7/022
代理机构 代理人
主权项
地址