| 摘要 |
PROBLEM TO BE SOLVED: To obtain a phenolic resin based adhesive composition having fast curability at low temperature, capable of manufacturing wooden products having low formaldehyde oder, such as plywood. SOLUTION: This phenolic resin based adhesive composition comprises 100 pts.wt of a phenolic resin adhesive comprising a resole type phenol/formaldehyde resin obtained by reacting formaldehyde (F) and phenol (P) in a mole ratio (F/P) of 2.2-3.0 in a first reaction step and a second reaction step carrying out the reaction by setting the mole ratio to 1.4-1.8 after the end of the first reaction step, 5-20 pts.wt of an isocyanate compound and 3-15 pts.wt of tannin extracted from Robinia pseudoacacia including >=70% of polyphenol.
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