发明名称 HOT-MELT ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a hot-melt adhesive composition having a moderately low melt viscosity, coatable in high precision, having high adhesion and adhesive force to an olefin resin and a cellulose fiber-based material, or the like, cohesion, heat resistance and creep resistance and slight oozing out to an adhesive member. SOLUTION: This hot-melt adhesive composition comprises a thermoplastic block copolymer, a tackifying resin solid at a room temperature and a plasticized oil liquid at a room temperature as essential components. The block copolymer is composed of one or more kinds of a component (a) (A-B)nM, a component (b) A-(B-A)m, a compound (c) (B-A)n and a compound (d) B-(A-B)m and a component (e) A-B (A is a vinyl aromatic hydrocarbon polymer block having a glass transition temperature equal to or higher than a room temperature; B is a butadiene polymer block, an isoprene polymer block or its hydrogenated polymer block; M is a residual substance/residue of a polyfunctional compound in which one or more polymer chains are bonded).
申请公布号 JP2001279212(A) 申请公布日期 2001.10.10
申请号 JP20000074546 申请日期 2000.03.16
申请人 SEKISUI CHEM CO LTD 发明人 HONDA JUNICHI
分类号 C09J153/02;(IPC1-7):C09J153/02 主分类号 C09J153/02
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