| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a film grown into columnar structure has low film packing ratio which causes cracking in a direction perpendicular to the film surface, and allow to penetrate foreign matter such as water from outside till an interface between a substrate and the film, so that the film becomes easy to slip on the substrate and also to be swollen. SOLUTION: The film deposition method by sputtering, in which two cathode electrodes are provided at least and two or more materials different in composition are used as targets, has a process and system in which during a whole or a part of the period of the deposition, both or either of the above two cathode electrodes is made to discharge alternately and able to deposit films different in composition.
|
