发明名称 |
ALKALI NEGATIVE DEVELOPMENT TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN AND ELECTRONIC PARTS |
摘要 |
PROBLEM TO BE SOLVED: To provide an alkali negative development type photosensitive resin composition which gives a pattern excellent in adhesiveness to a base substrate and having a good shape after development with an aqueous alkali solution and imparts high resolution by development, a method for producing a pattern by which the production is carried out by development with a low-cost aqueous alkali solution and a pattern excellent in adhesiveness to a base substrate and having a good shape is obtained after development, and to provide electronic parts excellent in reliability. SOLUTION: The alkali negative development type photosensitive resin composition contains (a) a polyimide precursor having an acid functional group in its molecular chain and soluble in an aqueous alkali solution, (b) a photosensitive agent and (c) a silicon compound having a reactive unsaturated functional group and an alkoxy or acyloxy group. |
申请公布号 |
JP2001281859(A) |
申请公布日期 |
2001.10.10 |
申请号 |
JP20000098906 |
申请日期 |
2000.03.31 |
申请人 |
HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD |
发明人 |
KOMATSU HIROSHI;KOJIMA YASUNORI;WATANABE NAOKI |
分类号 |
G03F7/037;C08F2/50;C08F283/04;C08F290/00;C08G73/10;G03F7/027;G03F7/038 |
主分类号 |
G03F7/037 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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