发明名称 |
Desiccation of moisture-sensitive electronic devices |
摘要 |
A method of desiccating an environment surrounding a moisture-sensitive electronic device sealed within an enclosure, includes selecting a desiccant comprised of solid particles having a particle size range 0.1 to 200 micrometers, the desiccant selected to provide an equilibrium minimum humidity level lower than a humidity level to which the device is sensitive within the sealed enclosure; choosing a binder that maintains or enhances the moisture absorption rate of the desiccant for blending the selected desiccant therein, the binder being in liquid phase or dissolved in a liquid; forming a castable blend including at least the desiccant particles and the binder, the blend having a preferred weight fraction of the desiccant particles in the blend in a range of 10% to 90%; casting a measured amount of the blend onto a portion of an interior surface of an enclosure to form a desiccant layer thereover, the enclosure having a sealing flange; solidifying the desiccant layer to a solid; and sealing the electronic device with the enclosure along the sealing flange. |
申请公布号 |
EP1143539(A2) |
申请公布日期 |
2001.10.10 |
申请号 |
EP20010201129 |
申请日期 |
2001.03.26 |
申请人 |
EASTMAN KODAK COMPANY |
发明人 |
BOROSON, MICHAEL LOUIS;SERBICKI, JEFFREY PETER;BESSEY, PETER G. |
分类号 |
B65D81/26;B01D53/26;F26B21/08;H01L23/18;H01L51/52 |
主分类号 |
B65D81/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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