| 摘要 |
A pin 53 for rough and then fine grinding of a notch in the edge of a semiconductor wafer comprises a spindle 130 and a cylindrical region comprising axially spaced rough and finish grinding sections 162 and 160 of resin bonded grit. The rough grinding section 162 is axially further from the spindle 130 than the finish grinding section 160 and comprises larger grit (e.g. 2-3 times the size). Both sections 160 and 162 are long enough for at least one (and preferably more) notch grinding groove 140 and 142 to be formed therein. The grit of the rough grinding section 162 may be CBN or diamond and that of the fine grinding section 160 may be diamond. The grooves 140 and 142 may be formed by a forming wheel (56 and 58, Fig. 2) mounted on a workpiece spindle of a CNC machine.
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