| 摘要 |
A semiconductor wafer has a dielectric layer. A bottom plate recess is first formed in the dielectric layer, and a metal bottom plate is formed in the bottom plate recess. An insulation layer is formed on the metal bottom plate, and a via hole is formed in the insulation layer. A first metal layer is then formed on the insulation layer that fills the via hole so as to form a via plug. Finally, a metal upper plate is formed on the insulation layer, and a metal wire is formed on top of the via plug.
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