发明名称 Heat sink devices for use in electronic devices
摘要 A heat sink device for use in desktop electronic devices comprises a heat sink which can be firmly attached to a CPU assembly with extremely great strength. The holes to be formed in the CPU circuit board of the CPU assembly or the heat sink can be made as small as possible to ensure a great advantage in design. Fastening members, connecting pins or like fasteners used are unlikely to project beyond the outer surface of the CPU assembly to ensure compactness. Furthermore, the heat sink device achieves a high radiation efficiency and is less costly to manufacture.
申请公布号 US6301115(B1) 申请公布日期 2001.10.09
申请号 US20000685558 申请日期 2000.10.11
申请人 SHOWA ALUMINUM CORPORATION 发明人 HASHIMOTO SUZUSHI;ITO TOMIO
分类号 H01L23/40;G06F1/20;H01L23/467;H05K7/20;(IPC1-7):H05K7/20 主分类号 H01L23/40
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