发明名称 DIVIDING DEVICE FOR SUBSTRATE HAVING DIVIDING GROOVE
摘要 PROBLEM TO BE SOLVED: To provide a substrate dividing device capable of dividing a substrate having dividing groves with the specified dimensional accuracy certainly at the specified dividing groove and performing the dividing operation quickly and in a great quantity without contaminating the substrate. SOLUTION: The substrate dividing device includes a transporting mechanism 2 to transport a substrate W having dividing grooves in the condition placed on a lower sheet 35 and a dividing mechanism 1 to divide the substrate W along the specified groove, wherein the dividing mechanism 1 comprises a splitting part 13 and restraining part 16 arranged movable in the vertical direction, a coupling part 15 installed movably on the splitting part 13 and laid horizontally on the restraining part 16, a drive shaft 21 abutting to the coupling part 15 and moved by a crank mechanism in the vertical direction, a stopper mechanism 17 to restrict the vertical motion of the restraining part 16, and a receptacle part 12 positioned opposing to the splitting part 13 and restraining part 16 in such a way as pinching the lower sheet 35 and installed between them 13 and 16.
申请公布号 JP2001277192(A) 申请公布日期 2001.10.09
申请号 JP20000091038 申请日期 2000.03.29
申请人 KYOCERA CORP 发明人 SAKASEGAWA KAZUYOSHI
分类号 B26F3/00;B28B11/14;B28D1/26;(IPC1-7):B26F3/00 主分类号 B26F3/00
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