| 摘要 |
PROBLEM TO BE SOLVED: To provide an auxiliary pad having required global uniformity and protruded part polishing selectivity and a polishing device provided with this auxiliary pad. SOLUTION: An auxiliary pad 2 formed by laminating soft/hard layers and a polishing pad 3 are secured by this order to an upper surface of a polishing base 1, the hard layer of the auxiliary pad 2 is opposed to the polishing base 1. A thickness of the auxiliary pad 2 is 5 mm or more 15 mm or less, a thickness of the soft layer is set to 20% or more 50% or less the thickness of the auxiliary pad 2. Hardness (A type of JIS-K6301) of the hard layer is 25 or more 60 or less, hardness of the soft layer is 3 or more 10 or less. A surface of the soft layer is formed with a plurality of sections by providing a plurality of grooves in lattice shape. |
