| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin bond wire saw which improves sharpness in the initial stage of cutting without dressing and keeps it for a long time while preventing the possibility of a break. SOLUTION: In a resin bond wire saw whose core wire 1 is bound with diamond abrasive grain 4 at its surface using a resin as a bonding agent, an unhardening layer that is low in hardness is formed on a shallow part 3a of a abrasive grain layer 2 by performing a hardening reaction using a thermosetting resin as the resin and such a light energy that the resin is completely hardened internally but not completely hardened shallowly when hardened by the light irradiation. |
