POLISHING PAD FOR SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a belt type polishing pad eliminating a decrease in mass productivity due to frequent dressing work and pad replacement in the conventional polishing table system and eliminating necessity for groove forming of the polishing pad by after work. SOLUTION: This polishing pad for a semiconductor wafer, constituted by arranging an abrasive material pattern formed by a fixed pitch in a belt direction on a belt-state carrier film, is used.