发明名称 Spring-loaded backing plate assembly for use with land grid array-type devices
摘要 A spring-loaded backing plate assembly for use with a printed circuit board, an electrical connector, and a land grid array-type device. The assembly comprises a backing plate adapted to support the printed circuit board and one or more leaf springs. A retainer assembly holds the leaf springs in a preloaded state against the backing plate and transfers compressive force from the leaf springs to the printed circuit board, electrical connector, and land grid array-type device.
申请公布号 US6299460(B1) 申请公布日期 2001.10.09
申请号 US20000549983 申请日期 2000.04.14
申请人 HEWLETT PACKARD COMPANY 发明人 HASELBY JEFFREY T.;PETERSON ERIC C.
分类号 H01R33/76;H01L23/32;H01R12/04;H01R12/16;H05K1/18;H05K3/32;H05K3/36;(IPC1-7):H01R12/00;H01R1/00 主分类号 H01R33/76
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