| 摘要 |
PROBLEM TO BE SOLVED: To strongly shield the mother board arranged to an electronic endoscope processor. SOLUTION: The mother board is a multilayered printed wiring board equipped with an insulating layer comprising a glass/epoxy resin or the like and a plurality of conductor layers comprising copper foils. A signal pattern region 30 and a non-signal pattern region 40 are formed on the surface of the outermost layer 20 positioned inside the chassis of the electronic endoscope processor having the mother board arranged thereto. The signal pattern region 30 is a region continuing in a predetermined range and all of the conductor patterns on the surface of the outermost layer 20 are gathered in the signal pattern region 30. A ground pattern is provided in the non-signal pattern region 40. The signal pattern region and non-signal pattern region corresponding to the signal pattern region 30 and the non-signal pattern region 40 are formed on even the outermost layer on the opposite side. The ground pattern of the non-signal pattern region of the outermost layer on the opposite side is closely bonded to the entire inner wall surface of the chassis of the electronic endoscope processor.
|
