| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for high-quality devices at a low cost and with good yield when a microstructure is to be molded through die transfer, whereby it is possible to control the thickness with high accuracy. SOLUTION: A resin material 35 is pinched by an actuator array layer 25 formed on semiconductor substrate 20 and a transfer die 61 and rotated by a rotation device such as a spinner so that a resin layer 35a is formed. If the transfer die 61 is released after hardening the resin layer 35a, a microstructure having the desired shape is obtained. This manufacturing method allows easy control of film thickness accurately at a low cost along with establishment of an enhanced yield.
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