发明名称 VACUUM LAMINATION METHOD AND APPARATUS THEREFOR
摘要 <p>PROBLEM TO BE SOLVED: To solve such a problem that surface smoothness is highly required in a built-up substrate or the like and the flowability of the resin applied to a laminating material must be improved and, therefore, a molding condition of a temperature of 100 deg.C or higher and a pressing time of 60 s or more is required and, under this molding condition, a feed film is easy to come into close contact with a surface plate and, in the case of a close contact state, the feed film can not be drawn toward a feed outlet and a molding cycle is interrupted. SOLUTION: A release device for peeling the feed film being in contact with the surface plate when both plate members are separated after the completion of molding is provided on the feed film outlet side of the plate members.</p>
申请公布号 JP2001277345(A) 申请公布日期 2001.10.09
申请号 JP20000101708 申请日期 2000.04.04
申请人 MEIKI CO LTD 发明人 MURASE KATSUMI;ISHIKAWA KOJI;SAKAKIBARA KATSUYUKI
分类号 B32B37/10;B29C43/56;B29C51/10;B29C51/14;B29C51/26;B29C51/46;B29L9/00;(IPC1-7):B29C51/26;B32B31/20 主分类号 B32B37/10
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