| 摘要 |
An electronic component cooling apparatus capable of enhancing cooling efficiency while having a heat sink including a plurality of radiation fins which are arranged in parallel to each other incorporated therein. Radiation fins of a heat sink are arranged in parallel to a pair of side walls of the heat sink and so as to be spaced from each other at intervals. The heat sink is formed with a plurality of parting slits for interrupting continuity of a part of a base of the heat sink and radiation fins adjacent to the side walls of the heat sink. The parting slits are arranged so as to extend from an outside of the side walls of the heat sink into the heat sink and in a manner to be spaced from each other at predetermined intervals. The parting slits are formed into a length which prevents the parting slits from interrupting continuity of a portion of the radiation fins which is not exposed directly to air flow generated from by rotation of blades of an impeller of an axial fan unit.
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