发明名称 Silicone composition for forming cured release films
摘要 This invention relates to a silicone composition comprising: (A) a mixture of (i) a linear trimethylsiloxy-terminated polydiorganosiloxane containing at least 2 alkenyl groups having at least 4 carbon atoms and (ii) optionally a linear dimethylalkenylsiloxy-terminated polydiorganosiloxane, (B) a polyorganohydrogensiloxane, (C) a catalytic quantity of a platinum catalyst, and (D) an inhibitor. The silicone compositions of this invention make it possible to form cured release films with low resistance to peeling when peeling is carried out at high speeds, and with the possibility of controlling the resistance to peeling between low and high values when peeling is carried out at low speeds. The silicone compositions of this invention also are not subject to a decrease in the coefficient of residual adhesion in the adhesive material applied onto a cured release film.
申请公布号 US6300426(B1) 申请公布日期 2001.10.09
申请号 US19990444357 申请日期 1999.11.18
申请人 DOW CORNING TORAY SILICONE COMPANY, LTD. 发明人 KOYAMA TAKU;TOGASHI ATSUSHI;YAMADA TAKATERU
分类号 B05D5/00;C08L83/00;C08L83/05;C08L83/07;C09D183/04;C09D183/07;(IPC1-7):C08L83/05;C08G77/12 主分类号 B05D5/00
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