发明名称 LASER CUT-OFF DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a laser cut-off device capable of cutting off a laser beam led from a large-scale laser producing equipment, without producing a reflecting light and a dispersed light affecting an operation in danger. SOLUTION: A laser beam L is caused to radiate to a cavity of a cut-off container 20 through a laser beam permeating window 40. The laser beam L radiating into the cut-off container 20 is converted into heat energy in a state of complete attenuation after repeating a reflection and permeation by means of a plural of carbon spherical object 30. Namely, the laser beam L radiating into the cut-off container 20 is not leaked outside on the basis of an effective absorption in the inside of the cut-off container 20. An element of a laser beam not absorbed by means of the carbon spherical object 30 is barely radiated outside through the laser beam permeating window 40. The heat energy converted from a laser beam by means of the carbon spherical object 30 is released outside via the cut-off container 20 and a cooling fin 50. Consequently, a temperature of the carbon spherical object 30 is maintained at a low level, and laser beam absorbing efficiency of the carbon spherical object 30 is maintained at a high level.</p>
申请公布号 JP2001276994(A) 申请公布日期 2001.10.09
申请号 JP20000094221 申请日期 2000.03.30
申请人 SUMITOMO HEAVY IND LTD 发明人 SASAKI TAKUYA
分类号 B23K26/18;H01S3/00;(IPC1-7):B23K26/18 主分类号 B23K26/18
代理机构 代理人
主权项
地址