| 摘要 |
A system for testing semiconductor components includes a testing apparatus, such as a test carrier for discrete components, or a wafer prober for wafer sized components The system also includes an interconnect for electrically engaging the components. The interconnect includes a thinned substrate, and first contacts on the substrate for electrically engaging second contacts on the components. The thinned substrate has a thickness that is substantially less than a thickness of the components being tested. The thinned substrate can flex upon application of a biasing force by the testing apparatus, permitting the first contacts to move in the z-direction to accommodate variations in the planarity of the second contacts.
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