| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor mounting substrate for a multilayer semiconductor device, semiconductor device and multilayer semiconductor device which can realize the reduction in size and a higher integration of a semiconductor package. SOLUTION: The semiconductor mounting substrate for a multilayer semiconductor device is a resin substrate which is provided, on a first face, with a first interconnection and recesses, and, on a second face, with second multilayer connections and second interlayer connections. The first interconnections are provided with chip connections, first multilayer connections, and first interlayer connections. The chip connection terminals are formed in an area where the recesses are formed, and the first interlayer connections are formed in the other area the where the recesses are formed. The interconnection including the chip connections and the first interlayer connections is formed along the first face. The semiconductor device has one or more semiconductor chips mounted on this substrate and the multilayer semiconductor device is a plurality of these stacked semiconductor devices. |
