发明名称 DIFFUSED BARRIER LAYER AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device which includes a diffused barrier layer. SOLUTION: A semiconductor device includes a semiconductor substrate including a conductive metallic element and a diffused barrier layer in contact with the conductive metallic element is bonded to at least a part of the substrate, has upper/lower faces and a center part, formed of silicon, carbon, nitrogen and hydrogen and in which silicon is distributed nonuniformly over the whole diffused barrier layer. Thus, concentration of nitrogen near the lower and upper faces of the diffused barrier layer is higher than at the center part of the diffused barrier layer. Then, a method for manufacturing the semiconductor device is also provided.
申请公布号 JP2001274250(A) 申请公布日期 2001.10.05
申请号 JP20010033679 申请日期 2001.02.09
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 KERN STEPHEN A;DOLDUN DIMOSI J;PHIZHIMONS JOHN A;STEPHEN MCCONELL GATES;LYN M GIGUNAKKU;PAUL CHARLES JAMISON;KANUKU LEE;PURUSHOTHAMAN SAMPATH;DARYL D RESUTAINO;EVA SIMONY;HORATIO SEYMOUR WILDMAN
分类号 H01L21/28;H01L21/31;H01L21/316;H01L21/318;H01L21/768;H01L23/522;H01L23/532;(IPC1-7):H01L21/768 主分类号 H01L21/28
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