PACKAGE FOR SEMICONDUCTOR ELEMENT STORAGE

摘要

PROBLEM TO BE SOLVED: To operate a semiconductor element normally and stably for a long period by preventing transmission property of high frequency signal from being damaged and transmitting heat during operation of a semiconductor element to a heat sink, a mounting substrate or the like effectively. SOLUTION: A heat sink 1 is constituted of a unidirectional composite material 1a where carbon fiber orientated in a thickness direction is combined by carbon. A metallic layer 1b where an Fe-Cr alloy layer 1b-1 and a Cu layer 1b-2 are laminated one by one from the side of the heat sink 1 is applied to an upper surface and a lower surface thereof. A base substrate 2 is formed of Cu and is 0.5 to 3 mm thick.