| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for treating a wafer, in which corrosion of waste fluid passage and leakage of ozone gas can be prevented by removing ozone from used solution containing ozone. SOLUTION: Multiple balls 33 of aluminum oxide are contained in an ozone decomposition chamber 31 and a detour 43, such that they do not impede conduction of used solution. Used solution discharged from a treating unit 2 touches the surface of aluminum oxide balls 33 to decompose ozone contained in the used solution efficiently. Consequently, highly reactive ozone scarcely remain in the used solution discharged from a discharge section 36.
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