| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which ensures the flexibility of a design, while increasing the number of mounting per unit area of a semiconductor chip to a major substrate. SOLUTION: This semiconductor device is a semiconductor device mounting a plurality of semiconductor chips, and comprises: a printed wiring substrate which is bent so as to have one or more substantially U-shaped curved parts and mounts the plurality of semiconductor device; and a connection part for electrically connecting the semiconductor device to a major substrate in at least one or more curved parts out of the one or more substantially U-shaped curved parts of the printed wiring substrate. |
