| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in sensitivity, resolution, developability and mechanical strength and effective in increasing the density of a printed wiring board and in laser exposure, a photosensitive element using the composition, a method for producing a resist pattern using the element and a method for producing a printed wiring board. SOLUTION: The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in one molecule and (C) a photopolymerization initiator containing (C1) acridine or an acridine compound having at least one acridinyl group in one molecule and (C2) an onium salt compound as essential components. The photosensitive element uses the composition. In the method for producing a resist pattern, the photosensitive element is laminated on a circuit forming board and patternwise irradiated with active light and the unexposed part is removed by development to produce the objective resist pattern. In the method for producing a printed wiring board, the circuit forming board with the produced resist pattern is etched or plated. |
