发明名称 THIN DIAMETER TUNNEL PLATE HEAT PIPE
摘要 PROBLEM TO BE SOLVED: To reduce the manufacturing cost for various plate heat pipes applying thin snaking heat pipe technology by utilizing extremely inexpensive porous flat pipes obtained through single process extrusion molding of a light metal effectively. SOLUTION: Every other barriers wall of a group of thin through holes are cut by a specified depth from the end face side on the opposite sides of a porous flat pipe and cut, while being shifted, on the opposite end face. The cut part is not collapsed over a length of 1-3 mm from the deepest part but collapsed at the opposite fringe parts of the flat pipe and then the collapsed fringe part is sealed by welding. The thin hole group forms a series of snaking tunnels, and a specified quantity of working liquid is encapsulated by a specified means thus constituting a plate heat pipe. Manufacturing cost is reduced by a factor of 10 through synergy of low price porous flat pipe, reduction of material to be used, shortening of process, and simplification of work while enhancing the performance and reliability as a heat pipe.
申请公布号 JP2001272188(A) 申请公布日期 2001.10.05
申请号 JP20000404351 申请日期 2000.12.20
申请人 ACTRONICS CO LTD;AKACHI HISATERU 发明人 AKACHI HISATERU
分类号 B23P15/26;B21D53/04;F28D15/02;F28F1/02;H01L23/427;(IPC1-7):F28D15/02 主分类号 B23P15/26
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