| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive flux where residual flux is not required to be removed by cleaning, after solder bonding is carried out, the photosensitive flux is kept high in electric insulation properties, even in an atmosphere of high temperature and humidity to realize a soldered joint of high bonding strength and reliability, and a resist pattern of high accuracy can be formed through a photographic method by development, in which alkaline water solution is used. SOLUTION: A photosensitive flux includes resin (A) possessed of at least one or more phenolic hydroxyl groups, resin (B) serving as a curing agent for the resin (A), and a sensitive agent (C) as integral components, and a flux pattern can be formed at a prescribed position through exposure and development by the use of the photosensitive flux. Furthermore, a soldered joint reinforced by resin contained in this photosensitive flux can be obtained. |
