CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a ceramic circuit board and its manufacturing method in which a bonding reliability between an insulating board and a metallic circuit is proper and a superior heatproof cyclic property can be maintained. SOLUTION: A metallic circuit forming surface 3 as a bonding interface between a ceramic insulating board 1 and a metallic circuit 2 which constitute a ceramic circuit board 100 is so formed as to be higher than a ceramic exposure surface 4 on which a metallic circuit is not formed. The terminal surface 5 of the metallic circuit, the terminal surface 6 of the metallic circuit forming surface and a ceramic exposure surface 4 are so formed as to serially and smoothly continue.