| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a printed wiring board, for surface mounting, whose connection reliability to a surface mounting component is superior. SOLUTION: A thermal-expansion buffer sheet 3 is laminated integrally on the printed-wiring board 2 on which the surface mounting component 100 is mounted. The coefficient of thermal expansion of the buffer sheet 3 is set at 6 to 12 ppm.</p> |
