| 摘要 |
PROBLEM TO BE SOLVED: To prevent insulation degradation in electronic circuit which leads to irregularity of electrical properties of an etectrical apparatus, resulting in breakdown of the electrical apparatus due to short-circuit at worst, caused by silver migration phenomenon in which silver is ionized in dc load in a high moisture atmosphere, moves from positive electrode to negative electrode and is deposited on the negative electrode side and grows there. SOLUTION: In a conductive paste containing sliver powder as conductive particles, the silver migration problem is resolved by forming a conductive paste in which indium tin oxide particles of 0.5 to 50 pts.wt., with several tens to several hundreds nanometers of primary particle diameter, is confined with 100 pts.wt. of silver powder.
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