| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can be eliminated with a resistor R0 for correcting a phase and has no deterioration in load regulation. SOLUTION: A first pad (28) is connected to a first output pin (32) of a package by a first bonding wire (30), and a second pad (36) is connected to the first output pin (32) by a second bonding wire (38), resulting in no deterioration in load regulation. A third pad (40) is connected to a second output pin (44) of the package, to which a capacitor (C0) for correcting a phase is connected by a third bonding wire (42), resulting in the elimination of the resistor for correcting a phase which has been necessary in the conventional method but is now can be substituted by the third bonding wire (42). |
