| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable an anisotropic conductive adhesive agent interposed between a semiconductor device and a board to be controlled in fluidity induced, when the semiconductor device and the board undergo thermocompression treatment to ensure the necessary number of the conductive particles 31a of the anisotropic conductive adhesive agent 31 trapped between the protrudent electrode of a semiconductor device and the board electrode 23 of the board 22, by which a fine connection of low in resistance and high reliability can be provided. SOLUTION: A semiconductor device is equipped with a protective film 13 having an opening located above a connection electrode pad 12, a fluidity control film 15 provided on the protective film 13 other than a connection region on the periphery of the semiconductor device 10, a common electrode film 15 provided on the connection electrode pad 12, and a protrudent electrode 17 provided on the common electrode film 14. A method of manufacturing the same is provided.</p> |
