发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device without a small concentration of electric field at a corner portion 6 of an activation region 2. SOLUTION: The semiconductor device includes a semiconductor substrate 1, an activation region 2 located on the semiconductor substrate 1 and having a side face 3 and an upper face 4 made up of a central part 5 vertically substantially to the side face 3 and a corner portion 6 having a downward slanted inclination and crossed with the side face 3, a channel region 8 located above the activation region 2 and having a part of the corner portion 6, a first main electrode region 9 and a second main electrode region 10 each located on the active region 2 and adjoining to the corner portion of the channel region 8, a gate oxide film 11 located on the upper face 4 of the activation region 2 and having such a film thickness that the thickness at the corner portion 6 is not less than that of the central part 5, and a control electrode 12 on the channel region 8.
申请公布号 JP2001274383(A) 申请公布日期 2001.10.05
申请号 JP20000087689 申请日期 2000.03.27
申请人 TOSHIBA CORP 发明人 OZAKI SHINGO;OGAWA MIKIO
分类号 H01L21/76;H01L29/78;(IPC1-7):H01L29/78 主分类号 H01L21/76
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