| 摘要 |
PROBLEM TO BE SOLVED: To provide a bimetal substrate and BGA structure that reduce manufacturing processes by carrying out hole-plugging on a blind via hole, and to improve productivity and reliability. SOLUTION: In the bimetal substrate, where a blind via hole 17 is formed by a laser beam 7 on a copper foil surface, at one surface of the configuration of copper foil 1/a base material 2/copper foil 4 for composing a double-sided copper covering laminated sheet with no adhesive layers, and Cu plating 13 is applied in the blind via hole 17 for electric conduction, and only the opening part of the blind via hole 17 is subjected to Cu plating 13. After that, Ni plating 18 and Au plating 8 are applied successively for plugging the blind via hole 17. |
