| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiation BGA package, which improves adhesion reliability by raising adhesion between radiation slag and a plastic circuit sub strate and at the same time prevents discoloration of a cavity surface of a semiconductor mounting part and does not damage adhesion reliability of a semiconductor chip, and its manufacturing method. SOLUTION: In a heat radiation BGA package A where a hollow 12 forms a cavity 14 for mounting a semiconductor chip 15 in an exposed surface of radiation slag 13 by adhering the metallic radiation slag 13 to one surface of a plastic circuit substrate 11 whose central part is the hollow 12, an adhesion surface to the plastic circuit substrate 11 of the radiation slat 13 is roughened by chemical roughening method and an exposed surface of the radiation slag 13 of the cavity 14 is subjected to oxidation treatment. |
