发明名称 IC SOCKET AND SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide an IC socket that improves workability in an exchange work of leads and a semiconductor device equipped with the IC socket. SOLUTION: The IC socket 1 is the IC socket 1 that is removable to a circuit board and that is equipped with a plurality of linear rod-shaped lead members 6a, 6b, lead modules 2a, 2b and a socket base body 17. The lead modules 2a, 2b are the exchangeable lead modules 2a, 2b that divide a plurality of lead materials 6a, 6b into a plurality of groups and that retains the lead members 6a, 6b in each group, and they are arranged in a plurality in order to retain each of the plurality of groups. The socket base body 17 is positioned between the circuit board and the lead modules 2a, 2b and decides the position of the lead modules 2a, 2b against the circuit board.</p>
申请公布号 JP2001273964(A) 申请公布日期 2001.10.05
申请号 JP20000088339 申请日期 2000.03.28
申请人 MITSUBISHI ELECTRIC CORP 发明人 SHIMIZU YOSHIYUKI
分类号 G01R31/26;G01R1/067;G01R1/073;H01R13/24;H01R33/76;H05K7/10;(IPC1-7):H01R33/76 主分类号 G01R31/26
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