| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can reduce such a fault as a pattern short generated in the wring patterns near the end surface of its board, in the semiconductor device wherein its semiconductor chip mounted on its board is sealed with a resin and its wiring pattern formed on its board which includes a plated wire reaches the edge of its board. SOLUTION: The semiconductor device has a board 11 wherein a wiring pattern 17A is formed on its one surface and the wiring pattern 17A reaches the edge the one surface, a semiconductor chip 12 mounted on the board 11 which has an integrated circuit, and a resin 15 so formed as to cover the wiring pattern 17A formed on the one surface and cover the semiconductor chip 12. Further, the resin 15 is so formed as to cover a plated wire 17B which reaches the edge of the one surface of the semiconductor device. |
