| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device which can securely protect an active area, and its manufacturing method. SOLUTION: An active surface 11a of a semiconductor substrate 11 forming the base of a semiconductor chip 10 is covered with a low-elasticity coating film 15 made of a material having a lower elasticity than the semiconductor substrate 11. The low-elasticity coating film 15 has an end surface coated part 15 which covers the corners 17 of the active surface 11a and also covers the end surfaces 18 of the semiconductor substrate 11 up to a position deeper than the active area 12. Consequently, the pitching at the corners 17 of the active surface 11a can be prevented.</p> |
