| 摘要 |
PROBLEM TO BE SOLVED: To prevent a semiconductor device from deteriorating in connection reliability, even if a comparatively inexpensive bumpless IC chip is used, where conductive particles not conducive to connection are eliminated when a semiconductor element is connected to a circuit board for the manufacture of a semiconductor device. SOLUTION: An adhesive layer 3 is provided on the connection terminals 2 of a circuit board 1, recesses 5 are provided to the adhesive layer 3 corresponding to the connection terminals 2, conductive particles 7 are supplied to the recesses 5 provided to the adhesive layer 3, the connection pads of a semiconductor device are aligned with the connection terminals 2 of the circuit board 1, and the circuit board 1 and the semiconductor device are bonded together by thermocompression through the intermediary of the supplied conductive particles 7 for the formation of a semiconductor device. |
