SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a package of semiconductors which can improve heat radiation of a semiconductor having large heat such as a power circuit and a method for manufacturing the semiconductor package. SOLUTION: A lower electrode 5 of the semiconductor 1 and a heat sink 10 are directly connected and a 1st electrode 2 and a 2nd electrode 3 are connected to a plate type 2nd conductor 14 by using a 1st conductor 11. the heat generated by the semiconductor 1 is conducted to the heat sink 10 and absorbed. Further, the heat is conducted by the 1st conductor 11 even to a 2nd conductor 14 to lower the temperature of the semiconductor 1.