发明名称 METHOD OF MANUFACTURING CIRCUIT DEVICE
摘要 PROBLEM TO BE SOLVED: To solve a problem in which a printed board, a ceramic board, a flexible sheet, or the like is used as a support board integrally to constitute a circuit device, where the support board is fundamentally an unnecessary member, and the thickness of the support board causes the circuit device to become larger in size. SOLUTION: A conductive foil 60 is pasted on a support board SS, separation grooves 54 are cut in the conductive foil 60, a circuit element is mounted on the conductive foil 60, and then the conductive foil 60 is coated with an insulating resin 50, Thereafter, a sealed body sealed up with the insulating resin 50 is separated from the support board SS. Therefore, a support board and a circuit device are not integrated, and a circuit device composed of a conductive circuit 51 and a circuit element 52 supported by the insulating resin 50 can be realized. Moreover, the circuit is equipped with wirings L1 to L2 which are integral components, and a curved structure 59 or an overhang 58 are provided, so that the insulating resin 50 will not slip out.
申请公布号 JP2001274184(A) 申请公布日期 2001.10.05
申请号 JP20000088828 申请日期 2000.03.28
申请人 SANYO ELECTRIC CO LTD 发明人 SAKAMOTO NORIAKI;KOBAYASHI YOSHIYUKI;SAKAMOTO JUNJI;MASHITA SHIGEAKI;OKAWA KATSUMI;MAEHARA EIJU;TAKAHASHI YUKITSUGU
分类号 H01L23/28;H01L21/56;H01L23/12;H01L23/50;H01L25/04;H01L25/10;H01L25/11;H01L25/18 主分类号 H01L23/28
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